Home Guides iPhone 15 Pro Max iPhone 15 Pro Max Chip ID

iPhone 15 Pro Max Chip ID

Images of the circuit board were captured with a United States-market iPhone 15 Pro Max, a device that omits a traditional SIM card slot while retaining internal components for cellular connectivity.The device incorporates hardware enabling compatibility with 5G millimeter wave frequencies.Furthermore, this model includes the necessary components to facilitate satellite communication capabilities.

  • Refer to our comprehensive iPhone 15 teardown documentation for a more in-depth analysis.

We extend our gratitude to community contributor Chunglin Chin for their valuable assistance in this project.

Step 1 | Main PCB Side 1

Step 1 image
Thumbnail 1
Thumbnail 2
  • The Apple 338S00537 incorporates an audio amplifier.This amplifier utilizes a Texas Instruments LM3567A1 for flash controller functionality.A Texas Instruments TPS65657B0 manages the display power supply requirements.
  • The Apple 338S00843 contains an audio Digital Signal Processor (DSP).The audio amplifier circuit is responsible for signal amplification.The LM3567A1 flash controller manages memory access and data transfer.
  • The TPS65657B0 provides regulated voltage to the display panel.The audio DSP performs digital audio processing operations.The 338S00537 component is a critical element in the audio pathway.
  • The 338S00843 component is integral to the audio processing chain.The LM3567A1 is a specialized integrated circuit.The TPS65657B0 ensures stable power delivery for the display.

Step 2 | Main PCB Side 1 - Connectivity

Step 2 image
  • The device in question is a near-field communication controller manufactured by NXP Semiconductor.

Step 3 | Main PCB Side 2

Step 3 image
Thumbnail 1
Thumbnail 2
  • The APL1V02/339S01257 component from Apple incorporates an A17 Pro applications processor featuring a six-core architecture.Integrated within this component is a hexa-core graphics processing unit, presumably built upon a SK hynix foundation.The SK hynix H58G66AK6HX132 chip provides 8 GB of LPDDR5 synchronous dynamic random-access memory.
    Apple's APL109A/338S01022 component handles power management functions for the device.The STMicroelectronics STCPM1A3 chip contributes to the overall power management system.Further power management is facilitated by the STMicroelectronics STB605A11 integrated circuit.
  • Apple's 338S00946-B0 component is dedicated to power management circuitry.The Apple 338S00616 component also plays a role in the device's power management.A battery charging function is likely implemented using the Texas Instruments SN2012017.
  • The A17 Pro processor's six cores enable advanced application performance.The integrated hexa-core GPU delivers high-performance graphics capabilities.The SK hynix H58G66AK6HX132 chip utilizes the LPDDR5 standard for memory access.
  • The 8 GB of LPDDR5 SDRAM provides ample memory for demanding applications.The APL109A/338S01022 component regulates voltage and current distribution.The STCPM1A3 chip from STMicroelectronics manages power delivery to various components.
  • The STB605A11 chip also contributes to efficient power regulation.The 338S00946-B0 component from Apple is specifically designed for power management tasks.The 338S00616 component further enhances the power management capabilities of the device.
  • The Texas Instruments SN2012017 chip controls the charging process of the battery.The A17 Pro applications processor utilizes a six-core design for enhanced processing speed.The GPU’s architecture is layered on top of the SK hynix memory module.
  • The LPDDR5 memory standard allows for high-speed data transfer rates.The STMicroelectronics chips work in conjunction to optimize power efficiency.The SN2012017 battery charger ensures safe and efficient battery replenishment.

Step 4

Step 4 image
  • The Broadcom BCM59365EA1IUBG facilitates wireless power reception.Apple utilizes the component identified as 338S00739 for audio CODEC functionality.An audio amplification process is enabled by Apple's 338S00537 component.
  • Winbond's W25Q80DVUXIE provides 1 MB of serial NOR flash memory storage.The device incorporates a serial NOR flash memory chip with a capacity of 1 megabyte.A Texas Instruments TPS61280H, likely, manages the battery's front-end DC-DC conversion.
  • The wireless power receiver chip is manufactured by Broadcom.Apple’s audio CODEC is designated by the part number 338S00739.The audio amplifier is identified by Apple’s part number 338S00537.
  • The Winbond W25Q80DVUXIE chip serves as a 1 MB serial NOR flash memory.Power is received wirelessly through the Broadcom BCM59365EA1IUBG.Audio signals are processed using the Apple 338S00739 audio CODEC.
  • Amplification of audio is achieved with the Apple 338S00537 audio amplifier.The 1 MB serial NOR flash memory is supplied by Winbond, model W25Q80DVUXIE.A DC-DC converter, probably from Texas Instruments, regulates the battery voltage (TPS61280H).

Step 5 | Main PCB Side 2 - Connectivity

Step 5 image
The component most probably involved is the Apple 339M00298 Ultra-Wideband (UWB) module.

Step 6 | Main PCB Side 2 - Sensors

Step 6 image
The Bosch Sensortec component integrates a micro-electro-mechanical system (MEMS) accelerometer and gyroscope, providing six axes of motion sensing capability.

Step 7 | Radio Board Side 1

Step 7 image
Thumbnail 1
Thumbnail 2
  • The repair process involves components manufactured by STMicroelectronics.Specifically, the ST33J serves as a secure microcontroller within the device's architecture.Qualcomm's PMX65 is integrated as a power management solution.
  • The system utilizes a Qualcomm QET7100 for wideband envelope tracking functionality.A probable Qualcomm clock generator is also present in the circuitry.These components require careful handling during disassembly and reassembly.
  • The ST33J microcontroller's security features must be respected to prevent data compromise.Power management responsibilities are delegated to the PMX65, impacting overall efficiency.The QET7100's wideband envelope tracking capabilities are crucial for signal integrity.
  • Verification of the Qualcomm clock generator's operation is essential for proper timing.

Step 8 | Radio Board Side 1 - Connectivity

Step 8 image
  • The device incorporates a Qualcomm SDX70M Snapdragon X70 modem.A Qualcomm SDR735 radio frequency transceiver is utilized within the system.The design also includes a Qualcomm SMR546 radio frequency transceiver.
  • An Apple 339S01232 module manages both wireless networking and Bluetooth connectivity.The front-end architecture incorporates a Broadcom AFEM-8234 module.
  • A Skyworks SKY58440-11 front-end module is present in the design.The system's radio frequency performance is enhanced by a Qorvo QM76305 front-end module.
  • The SDX70M modem provides advanced cellular communication capabilities.
  • The SDR735 transceiver facilitates efficient radio signal transmission and reception.The SMR546 transceiver contributes to the overall radio frequency performance.
  • The Apple module supports IEEE 802.11 wireless standards and Bluetooth protocols.The Broadcom AFEM-8234 module integrates multiple radio frequency components.
  • The SKY58440-11 module is designed for compact and efficient radio frequency applications.The QM76305 module optimizes signal performance and power efficiency.

Step 9

Step 9 image
  • The issue may stem from a Skyworks component.A specific Skyworks part, identified as SKY50313, is suspected.This component functions as a front-end module within the device.
  • The origin of the module could be Apple.Apple's part number for this module is 339M00287.This module also serves as a front-end module.
  • Alternatively, the fault might be related to a Broadcom component.The Broadcom component in question is designated AFEM-8245.Like the others, this part also functions as a front-end module.
Check COD Availability

Enter your pincode to see if Cash on Delivery is available in your area.

Please enter a valid 6-digit pincode