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iPhone 16 Chip ID

Photographs of the circuit board were captured with a United States-market iPhone 16 device.

  • Refer to our comprehensive disassembly guide for further information.The iPhone 16, despite its absence of a physical SIM card slot, incorporates components enabling 5G millimeter wave connectivity.Additionally, this iPhone 16 model includes the necessary hardware for satellite communication functionality.
  • A detailed iPhone 16 teardown is available for expanded technical specifications.We extend our gratitude to Chunglin Chin, a valued member of our community, for their assistance in this repair guide.This repair documentation benefits significantly from the contributions of Chunglin Chin.

Step 1 | Logic board overview

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  • Within the iPhone 16, the logic board incorporates a pair of double-layer printed circuit boards (PCBs), specifically designated as the RF board's upper and lower sections.
  • The radio frequency (RF) board's upper portion is a double-sided PCB.
  • A double-sided PCB forms the lower section of the radio frequency (RF) board.
  • The primary logic board's functionality is supported by a double-sided PCB located in the upper region.
  • The lower portion of the main logic board utilizes a double-sided PCB.

Step 2 | RF Board Top

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This repair guide addresses the Qualcomm PMX65-000 power management integrated circuit.

Step 3 | RF Board Top - Connectivity

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  • The Qualcomm SDR735-001 serves as a radio frequency transceiver.
  • Functionality is provided by the Qualcomm SMR546-002 as an intermediate frequency transceiver.
  • A Skyworks front-end module is incorporated into the design.

Step 4 | RF Board Bottom

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  • The Cirrus Logic 338S01087 component functions as an audio amplifier.
  • Timekeeping for the device is managed by a Qualcomm clock generator.
  • An Analog Devices MAX11390A facilitates analog-to-digital conversion within the system.
  • The Qualcomm QET7100-001 is responsible for wideband envelope tracking operations.
  • A Qorvo power supply provides electrical energy specifically for the envelope tracker.
  • Power regulation is achieved using an Apple 338S00616 DC-DC converter.

Step 5 | RF Board Bottom - Connectivity

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  • The Qualcomm SDX71M-000 modem is a key component.A Skyworks SKY58440-11 front-end module is utilized within the device.
  • The Broadcom AFEM-8243 also functions as a front-end module.An NFC controller manufactured by NXP Semiconductors may be present.
  • The SDX71M-000 modem facilitates wireless communication capabilities.The SKY58440-11 module manages radio frequency signals.
  • The AFEM-8243 front-end module provides signal amplification and filtering.The NFC controller enables short-range wireless data exchange.

Step 6 | Main Board Top

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  • The SK hynix H58G66BK8HX153 represents an 8 GB LPDDR5X SDRAM module, integrated as a stacked layer.This memory component is paired with the Apple APL1V08 / 339S01531 A18 hexa-core applications processor, which incorporates a graphics processing unit (GPU) and a neural engine.Power regulation for the system is managed by the Apple APL109A / 338S01119 power management integrated circuit.
  • A Texas Instruments CP3200B1G0 serves as the battery charging solution within the device.
  • Audio amplification is provided by the Cirrus Logic 338S01087 component.The illumination of the device's flash is controlled by the Texas Instruments LM3567A1 LED driver.
  • Display power is supplied by the Samsung S2DOS24 power supply unit.
  • The SDRAM module's density is 8 gigabytes, utilizing the LPDDR5X standard.
  • The Apple A18 processor utilizes a six-core architecture, combining processing capabilities with graphics and machine learning acceleration.

Step 7 | Main Board Top - Connectivity

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  • The Broadcom AFEM-8234 represents a front-end module.This component is identified as a front-end module and manufactured by Broadcom, bearing the model number AFEM-8234.

Step 8 | Main Board Bottom

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  • The Kioxia K5A3XF7346 component represents a 128 gigabyte NAND flash memory device.Power management functionality is provided by the STMicroelectronics STPMIA3A426AEQ.
  • The Texas Instruments SN2012027 handles USB type-C communication and control.
  • A GigaDevice GD25Q80E, offering 1 megabyte of serial NOR flash memory, is also present.Wireless charging operations are managed through the Broadcom BCM59367A1 controller.
  • Audio processing is facilitated by the Cirrus Logic 338S00967 audio codec.
  • The Qualcomm QET7100-001 is responsible for wideband envelope tracking.
  • This component suite includes a Kioxia NAND flash memory with a capacity of 128 GB.
  • The STMicroelectronics power management IC, Texas Instruments USB-C controller, GigaDevice NOR flash, Broadcom wireless charging controller, Cirrus Logic audio codec, and Qualcomm envelope tracker are all integral parts of the system.

Step 9 | Main Board Bottom - Connectivity

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  • The component identified as USI 339S01463 incorporates both Bluetooth and WiFi communication capabilities.This USI module also functions as an Ultra-Wideband (UWB) transceiver.
  • An NFC controller manufactured by NXP Semiconductors is integrated within the system.
  • These components collectively provide wireless connectivity and near-field communication functionality.

Step 10 | Main Board Bottom - Sensors

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The Bosch Sensortec accelerometer and gyroscope is the component being referenced.

Step 11 | Camera Control Button

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  • The AD7149-6 is a touch controller manufactured by Analog Devices.
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