iPhone 3G Teardown
The iPhone was taken apart for analysis on July 11, 2008.
Step 1 | iPhone 3G Teardown
The iPhone's teardown began at 5:01 AM Pacific time, which corresponds to 12:01 AM on July 11, 2008, in New Zealand.
Monitor this resource for ongoing updates; we will continue to refine the content with additional details discovered in the coming days.
For media inquiries, please contact Kyle at kyle@ifixit.com, and we welcome the opportunity to discuss a potential interview.
Monitor this resource for ongoing updates; we will continue to refine the content with additional details discovered in the coming days.
For media inquiries, please contact Kyle at kyle@ifixit.com, and we welcome the opportunity to discuss a potential interview.
Step 2
Proceed to Auckland.
Step 3
The designated location has been reached.
Positioned fourth in a queue that formed during an overnight wait, there were five individuals present.
The ambient temperature is low.
Vodafone has provided considerable assistance, and iPhone Jonny has additionally supplied a stationary bicycle.
Positioned fourth in a queue that formed during an overnight wait, there were five individuals present.
The ambient temperature is low.
Vodafone has provided considerable assistance, and iPhone Jonny has additionally supplied a stationary bicycle.
Step 4
Around 5:00 PM, a television was delivered for the purpose of monitoring news coverage featuring our team.
By 5:00 PM, a queue of 15 individuals had formed, quickly expanding to encircle the corner.
By 5:00 PM, a queue of 15 individuals had formed, quickly expanding to encircle the corner.
Step 5
Due to high demand and limited availability following last night's promotional event at the Vodafone store, these t-shirts are currently only obtainable through online marketplaces like eBay.
Only Engadget, another American media outlet, documented the departure and published photographs identifying the initial ten individuals waiting in line.
Only Engadget, another American media outlet, documented the departure and published photographs identifying the initial ten individuals waiting in line.
Step 6
Demonstrate the shirts' design and fit by observing them being worn.
Despite the current winter weather and rainfall, we remain sheltered by the awning.
Despite the current winter weather and rainfall, we remain sheltered by the awning.
Step 7
Approximately 90 individuals remain in the queue, and the estimated wait time is 135 minutes.
The Vodafone logo is extremely difficult to discern from a distance along the cable.
Vodafone-branded knit hats, commonly referred to as "beanies," are exceptionally popular.
The Vodafone logo is extremely difficult to discern from a distance along the cable.
Vodafone-branded knit hats, commonly referred to as "beanies," are exceptionally popular.
Step 8
This unit, identified as the black model, was acquired for $979 New Zealand dollars and is currently locked to the Vodafone network; while white variations may exist, they are exceptionally uncommon. Its intended use in California remains to be determined.
Recognize the components and materials by their appearance.
Initial data indicates these parameters:
At 4.5 inches by 2.4 inches by 0.48 inches—a difference of 0.02 inches in thickness compared to the initial iPhone model—the iPhone 3G has a mass of 4.7 ounces, which is 0.1 ounce lighter than its predecessor; this weight is roughly equivalent to that of two swallows that are not carrying any load.
Due to the redesigned, curved rear casing, the iPhone's dimensions are not straightforward to determine using traditional geometric formulas; therefore, avoid attempting to measure its volume by displacement.
This screen measures 3.5 inches diagonally and offers a resolution of 480 by 320 pixels, resulting in a pixel density of 163 pixels per inch; it's a component functionally equivalent to those found in iPhones.
Recognize the components and materials by their appearance.
Initial data indicates these parameters:
At 4.5 inches by 2.4 inches by 0.48 inches—a difference of 0.02 inches in thickness compared to the initial iPhone model—the iPhone 3G has a mass of 4.7 ounces, which is 0.1 ounce lighter than its predecessor; this weight is roughly equivalent to that of two swallows that are not carrying any load.
Due to the redesigned, curved rear casing, the iPhone's dimensions are not straightforward to determine using traditional geometric formulas; therefore, avoid attempting to measure its volume by displacement.
This screen measures 3.5 inches diagonally and offers a resolution of 480 by 320 pixels, resulting in a pixel density of 163 pixels per inch; it's a component functionally equivalent to those found in iPhones.
Step 9
Carefully unpack the contents, noting the presence of all listed components and verifying their quantities against the parts list.
Connect the provided cable to establish a link between the device and a USB docking station.
Apple's included earphones, designed for compatibility with iPhone devices.
Employ a power adapter delivering USB voltage.
This power connector is a New Zealand type, an unexpected inclusion in the parts packaging.
Connect the provided cable to establish a link between the device and a USB docking station.
Apple's included earphones, designed for compatibility with iPhone devices.
Employ a power adapter delivering USB voltage.
This power connector is a New Zealand type, an unexpected inclusion in the parts packaging.
Step 10
Use the provided SIM eject tool, which is included with the iPhone 3G, to extract the SIM card.
A noteworthy improvement on the iPhone 3G is the headphone jack's design, which sits level with the device's surface, enabling compatibility with headphones not manufactured by Apple without requiring an adapter.
A noteworthy improvement on the iPhone 3G is the headphone jack's design, which sits level with the device's surface, enabling compatibility with headphones not manufactured by Apple without requiring an adapter.
Step 11
As a reference point, you can find a detailed guide on how to take apart the previous iPhone model online.
- We anticipate these outcomes.
- The processor is a Samsung component branded by Apple.
- The device must either include an Infineon GPS chip or lack GPS functionality entirely; if no discrete GPS chip is present, the GPS receiver may be integrated within the processor.
- Many integrated circuits bear solely Apple's branding, necessitating disassembly to identify their function in most instances.
- Carefully detach the display assembly by releasing the four 3.5mm Phillips screws securing it to the chassis, then gently slide the display upwards and away from the device, observing that it is connected with a flexible cable and should not be forced.
Step 12
Pivot the screen upwards.
Connectors to the logic board are sequentially identified with orange adhesive labels, numbered 1 to 6 by Apple.
Because the camera's connection is situated on the logic board's lower edge, accessing it for removal will probably require logic board disassembly from the device. While we have not performed this camera removal procedure, we anticipate that, similar to the original iPhone 3G design, the camera can be detached, allowing for secure device placement in sensitive environments.
Following the United States product launch, TechOnline will be removing the ceramic coating from unidentified integrated circuits via an acid immersion process, enabling detailed internal analysis utilizing X-ray technology and specialized diagnostic tools.
Connectors to the logic board are sequentially identified with orange adhesive labels, numbered 1 to 6 by Apple.
Because the camera's connection is situated on the logic board's lower edge, accessing it for removal will probably require logic board disassembly from the device. While we have not performed this camera removal procedure, we anticipate that, similar to the original iPhone 3G design, the camera can be detached, allowing for secure device placement in sensitive environments.
Following the United States product launch, TechOnline will be removing the ceramic coating from unidentified integrated circuits via an acid immersion process, enabling detailed internal analysis utilizing X-ray technology and specialized diagnostic tools.
Step 13
The unit's display component has detached.
Unlike the original iPhone design, the iPhone 3G’s LCD and protective glass are now distinct parts, mirroring the iPod Touch construction. Previously, these components were bonded together, which substantially increased the cost of screen replacements. Given that the glass is the most frequently damaged part, this separation simplifies and reduces the expense of iPhone 3G repairs.
Unlike the original iPhone design, the iPhone 3G’s LCD and protective glass are now distinct parts, mirroring the iPod Touch construction. Previously, these components were bonded together, which substantially increased the cost of screen replacements. Given that the glass is the most frequently damaged part, this separation simplifies and reduces the expense of iPhone 3G repairs.
Step 14
To detach the glass component from the LCD panel, use a Phillips #00 screwdriver to unscrew and remove all six screws.
During LCD panel removal, note that the glass component, which incorporates touch sensor technology and embedded chips, is located directly below.
Unlike earlier iPhone models where the display integrated numerous components, the current design features a display directly connected to the main board, simplifying the replacement process and addressing previous difficulties in sourcing reliable display components.
During LCD panel removal, note that the glass component, which incorporates touch sensor technology and embedded chips, is located directly below.
Unlike earlier iPhone models where the display integrated numerous components, the current design features a display directly connected to the main board, simplifying the replacement process and addressing previous difficulties in sourcing reliable display components.
Step 15
Carefully examine the internal components of the iPhone to locate the 3G circuitry.
The logic and communications boards have been integrated into a single, elongated component, extending along the device's full length instead of being stacked as in previous designs, likely to accommodate a larger battery.
The resulting images are exceptionally good, thanks to the invaluable assistance of our collaborators in New Zealand.
For assistance with Macintosh products, consider contacting Mac Solutions, a Macintosh sales and support business founded in 1998 and located on Auckland’s North Shore; Andrei Smirnov of Mac Solutions provided valuable support for this guide.
The logic and communications boards have been integrated into a single, elongated component, extending along the device's full length instead of being stacked as in previous designs, likely to accommodate a larger battery.
The resulting images are exceptionally good, thanks to the invaluable assistance of our collaborators in New Zealand.
For assistance with Macintosh products, consider contacting Mac Solutions, a Macintosh sales and support business founded in 1998 and located on Auckland’s North Shore; Andrei Smirnov of Mac Solutions provided valuable support for this guide.
Step 16
Carefully assess the situation.
Carefully detach the component.
Due to a potential buildup of internal pressure, the device may rupture.
Carefully detach the component.
Due to a potential buildup of internal pressure, the device may rupture.
Step 17
This is a deliberate, humorous interruption to prevent confusion and should be disregarded when proceeding with the repair instructions.
The battery is not affixed with a solder joint.
Feedback submitted to Apple may influence future product design and functionality.
The battery is not affixed with a solder joint.
Feedback submitted to Apple may influence future product design and functionality.
Step 18
Connect the docking connector and headphone connector.
This component obscures the main antenna, which is located on the opposite side.
After full disassembly of the device, we will begin documenting the identifying numbers found on each integrated circuit. We welcome your assistance in recognizing these components; please share any relevant details you may have.Contact iPhone repair support at ifixit.com using the email address iphone3g.To protect the individual's privacy, no identifying details will be disclosed.
This component obscures the main antenna, which is located on the opposite side.
After full disassembly of the device, we will begin documenting the identifying numbers found on each integrated circuit. We welcome your assistance in recognizing these components; please share any relevant details you may have.Contact iPhone repair support at ifixit.com using the email address iphone3g.To protect the individual's privacy, no identifying details will be disclosed.
Step 19
Proceed with the following steps, as they involve critical components and require careful attention to detail.
The iPhone's printed circuit board components have been comprehensively cataloged in this guide.
The comprehensive catalog of significant iPhone components, including integrated circuits, has been published by Semiconductor Insights and TechOnline, and we are utilizing the images they have generously supplied. Our team is currently confirming their findings, anticipating a high degree of accuracy exceeding our own verification process.
Based on our assessment, the following is a breakdown of the chips used, categorized by manufacturer, with key components highlighted in bold.
If your specific integrated circuit isn't listed, don't be alarmed; we can incorporate it into our documentation upon request.
The iPhone's printed circuit board components have been comprehensively cataloged in this guide.
The comprehensive catalog of significant iPhone components, including integrated circuits, has been published by Semiconductor Insights and TechOnline, and we are utilizing the images they have generously supplied. Our team is currently confirming their findings, anticipating a high degree of accuracy exceeding our own verification process.
Based on our assessment, the following is a breakdown of the chips used, categorized by manufacturer, with key components highlighted in bold.
- Identify the Broadcom component, designated as number 1.
- Identify the Infineon 4 component.
- Identify the Intel component designated as number one.
- Refer to Linear Technology component 1.
- Identify the Marvell 1 component.
- Refer to National Semiconductor document 1.
- Refer to NXP component 1.
- Refer to Samsung model 1.
- Utilize Skyworks component 1.
- Use the specified specialized tool, SST 1.
- Identify component ST Micro 1.
- Identify the Toshiba model number one.
- Utilize the Triquint 3 component, often referred to as "big win."
- Refer to Wolfson component 1.
If your specific integrated circuit isn't listed, don't be alarmed; we can incorporate it into our documentation upon request.
Step 20
The CSR BlueCore Bluetooth + WiFi chipset utilizes Marvell technology.
The processor utilized in this device is identical to those found in the original iPhone and early iPod Touch models.
Both iPhone logic boards examined to date have utilized Toshiba-produced flash memory. Whether this remains consistent requires further observation.
The processor utilized in this device is identical to those found in the original iPhone and early iPod Touch models.
Both iPhone logic boards examined to date have utilized Toshiba-produced flash memory. Whether this remains consistent requires further observation.
Step 21
- Locate the Intel NOR flash chip, identified as 3050M0Y0CE 5818A456, situated on the middle left side of the component view.
- Locate the largest integrated circuit situated in the upper left area of the board; it's an Infineon 337S3394, utilizing a WEDGE package and identified by the marking SP836175 G0822.
- Observe a minor chip located to the right of the NOR, specifically the Infineon BGA736 (Tri-Band HSDPA LNA). Directly below this component, you'll find an Infineon UMTS Transceiver identified by the marking 338S03532Z 60814.
- Refer to the Octopart datasheet for specifications and details regarding the SKY77340, a Skyworks power amplifier module featuring a quad configuration, located on the top right of the board.
- This Infineon SM-Power3i SMP 3i 6820 chip, sourced from Infineon, is designed for modem and data card applications utilizing X-GOLD208 and X-GOLD 608 architectures, and supports functionalities from EDGE through 3G and HSDPA.
- Locate chips labeled "6475" and bearing an "M" logo; these are suspected to be Murata IF SAW Filters.
Step 22
Carefully detach the EMI shield from the right side of the board; the preceding image shows the upper-right section of the board in question, and this shielding removal requires patience due to its complexity.
To share your feedback openly, post on the Gizmodo forums or send a message to iFixit's Twitter account; Summize will then automatically incorporate your contribution.
Step 23
- Observe the remaining circuit board, noting the Apple-labeled ARM processor located on the left side and the SIM card slot positioned centrally at the bottom.
- Samsung's processor incorporates DDR SRAM markers, consistent with previous observations.
- The processor bears the following identifying marks: 339S0036, ARM EMC567DB, 819, 8900B, N182F0A3, 0825, 7511.101, ZPD8163Y, 5974V, CKUFBG, HE0819, 870628, P12, and N3. Note that the Samsung DDR memory chip (part number K4X1G163PC-DGC3) on this board differs from the original iPhone's memory chip (K4X1G153PC).
- To the left of the SIM card, you'll find an SST25VF040B 1MB SPI Serial Flash memory chip and a National Semiconductor LM2512AA Display Interface.
- The component designated APPLE 338S0506 incorporates a Wolfson WM6180C, notable for an unusual labeling practice. APPLE 338S0512 utilizes a power management integrated circuit from NXP, intentionally obscured in its identification.
- Located on the board's middle-right section is the GPS chip, identifiable as a grey component and confirmed to be an Infineon PBM2525 Hammerhead II; earlier speculation regarding its processor integration has been refuted.
- Located adjacent to the processor, identifiable by the Apple logo, is the ST Micro LIS331 DL Accelerometer, a circular component with a grey finish.
Step 24
Following removal of the metallic shielding, examine the logic board's rear surface.
Step 25
After detaching a cover that was soldered in place, you'll find the 8GB Toshiba TH58NVG6D1DTG80 NAND flash chip; a plastic shield previously protected it, and we have carefully removed a portion of this shield to allow visibility of the chip's identifying details.
Step 26
Located at the base of the board are three TriQuint Tritium PA-duplexer chips, specifically identified as TQM616035, TQM676031, and TQM666032.Each unit likely operates within a distinct frequency range.Within each complex module, you will find a Tx input filter, a linear Power Amplifier, a Duplexer, and a Coupler, all combined into a single unit.
The identification of this issue has positively impacted TriQuint's stock performance, resulting in a measurable improvement.
The identification of this issue has positively impacted TriQuint's stock performance, resulting in a measurable improvement.
Step 27
The back cover is still attached.The diagnostic test revealed the leakage was consistent with expected values.
The rear casing utilizes ABS plastic construction, differing from the metal found on earlier iPhone models; its surface coating provides a pleasant tactile feel and exhibits a high degree of reflectivity, and its long-term durability remains to be determined.
A serial number is absent from the rear casing; it’s currently undetermined whether this is specific to the device being examined or a characteristic of all 3G iPhone models.
The rear casing utilizes ABS plastic construction, differing from the metal found on earlier iPhone models; its surface coating provides a pleasant tactile feel and exhibits a high degree of reflectivity, and its long-term durability remains to be determined.
A serial number is absent from the rear casing; it’s currently undetermined whether this is specific to the device being examined or a characteristic of all 3G iPhone models.
Step 28
Carefully handle the power cell, ensuring its voltage remains within the specified range of 3.7 volts, and observe all safety precautions when working with this component.No soldering is required; proceed using Apple part number 616-0372.
The battery's recycle marker has been obscured with a permanent marker, which warrants careful inspection.
The battery's listed part number indicates a capacity of 1150 mAh, differing from the initially stated 1400 mAh; further investigation into this discrepancy is requested.
The battery's recycle marker has been obscured with a permanent marker, which warrants careful inspection.
The battery's listed part number indicates a capacity of 1150 mAh, differing from the initially stated 1400 mAh; further investigation into this discrepancy is requested.
Step 29
Arranged sequentially, starting in the upper-left corner and progressing to the lower-right, are the display glass, LCD panel, main board and EMI shield, the antenna and battery assembly, and the back panel.
Further updates to the integrated circuits will be published periodically, so revisit this guide for the latest information; additional images will be provided upon request, but content creation is temporarily paused due to fatigue following a 48-hour wait.
The successful completion of this project was made possible by the generous assistance of several Auckland residents.
Brochuresunlimited’s Grant Virtue is the contact person for the downtown Auckland facility.
Acknowledging Oleg Boukhvalov of Weblab for his electronic skills and assistance during the disassembly process.
Acknowledging Andrei Smirnov from MacSolutions for his comprehensive coordination of this process.
An extensive range of replacement components for the iPhone 3G will shortly be available, accompanied by a comprehensive disassembly manual.
Further updates to the integrated circuits will be published periodically, so revisit this guide for the latest information; additional images will be provided upon request, but content creation is temporarily paused due to fatigue following a 48-hour wait.
The successful completion of this project was made possible by the generous assistance of several Auckland residents.
Brochuresunlimited’s Grant Virtue is the contact person for the downtown Auckland facility.
Acknowledging Oleg Boukhvalov of Weblab for his electronic skills and assistance during the disassembly process.
Acknowledging Andrei Smirnov from MacSolutions for his comprehensive coordination of this process.
An extensive range of replacement components for the iPhone 3G will shortly be available, accompanied by a comprehensive disassembly manual.