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iPhone 5S Teardown by X-ray

Before disassembling an iPhone 6, which experienced immediate sell-out upon release, an x-ray examination of an Apple iPhone 5S was performed as preliminary preparation.

Prior to starting the repair, review the device specifications: the inspected iPhone 5S, a white model with 16GB of storage, was examined using x-ray technology while fully assembled and powered on, ensuring no components were disassembled.

Next, proceed with an internal inspection.

Step 1 | iPhone 5S Teardown by X-ray

Step 1 image
Employing the TruView 200, a high-resolution x-ray inspection system, we will examine the internal components of an iPhone 5s; this system utilizes a 130kV microfocus source paired with a sizable 3"x4" x-ray sensor that achieves 1 micrometer resolution.
Refer to the TruView Number Series documentation for detailed specifications regarding the system's design and functionality.

Step 2

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Begin the diagnostic assessment utilizing x-ray imaging equipment.
The device incorporates a 1.2-megapixel FaceTime camera.
The camera features an 8-megapixel iSight sensor, utilizing larger 1.5-micrometer pixels.
The processor utilizes a 64-bit architecture and is identified as the Apple A7.
The iPhone 5S utilizes a battery with a capacity of 1560 mAh and a power output between 3.8V and 5.92Wh, representing a slight increase compared to the iPhone 5's 5.45 Wh and 1440 mAh. Expect up to 8 hours of talk time when using a 3G network, and a standby time of up to 225 hours.
Carefully handle the component, ensuring no damage occurs, and refer to the parts list for identification.
The connector for the Lightning port and the Touch ID sensor are integrated.
The headphone connector utilizes a 3.5mm diameter.

Step 3

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The iPhone 5S incorporates these components within its powertrain system.
Apple part number 338S120L.
The Qualcomm MDM9615M LTE Modem utilizes the Qualcomm PM8018 RF power management IC.
This component functions as a transceiver, supporting LTE, HSPA+, CDMA2K, TDSCDMA, EDGE, and GPS communication protocols.
Avago A790720

Step 4

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During x-ray analysis of the iPhone 5S, a significant quantity of voids were observed within the Apple 338S120L chipset, a factor known to negatively impact electronic product reliability. To quantify these voids, measurements were taken utilizing the BGA inspector feature of the TruView 200.

Step 5

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Examination of BGA solder joints on the Apple 338S120L reveals void percentages reaching up to 35%, a characteristic not observed in other surface mount components within the iPhone 5S; while this doesn't inherently indicate a defect, it warrants review and verification by quality control personnel.
Using the BGA inspector, a three-dimensional visualization of void characteristics is generated, displaying x-y coordinates and void density as height values within the volume.

Step 6

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The iSight Camera module within the iPhone 5s incorporates 8-megapixel image resolution, autofocus functionality, and automatic High Dynamic Range (auto HDR) capabilities, contributing to its photographic performance.
Its dimensions closely resemble those of the camera module found in the iPhone 5.

Step 7

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Observe the iPhone 5S's corner, where the usual 3.5mm audio connector is visible, along with a portion of the Touch ID interface and its associated components.

Step 8

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The x-ray image illustrates the Touch ID sensor’s position directly above the Lightning connector, demonstrating their overlapping placement.

Step 9

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The lower-right corner of the iPhone 5S maintains the same design as earlier iPhone 5 and 4S models; specifically, the high-performance speaker occupies the identical position, and the antenna connections exhibit a highly comparable configuration.
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