Following complete disassembly of the iPhone 7 Plus, this guide proceeds with the third step in our Tokyo teardown series. The device is missing one camera module and retains the original quantity of headphone jacks.Ensure the device is a 7 Plus model.We are pleased to present this guide.Apple iPhone 7Disassemble the unit.
The SIM tray is released via a complex mechanical linkage; applying pressure with the SIM eject tool depresses a plastic pin, which then transmits force to a metal pin, ultimately causing the SIM tray to pop out.
This additional measure provides a further safeguard against accidental drops into the toilet bowl.
Apple also incorporated a rubber gasket to seal the SIM tray.
To facilitate a detailed inspection of the integrated circuits, detach the logic board promptly.
Before proceeding, examine the iPhone 7 Plus logic board alongside the one you are working on to observe their similarities, recognizing that while the housings differ in size, the boards themselves share a comparable design.
Carefully observe that connector dimensions and positions, along with the placement of post holes and screws, exhibit slight variations.
Despite the familiar design, adjustments were necessary to accommodate the specific requirements of the iPhone 7 Plus's internal components and circuitry.
Expect to find a significant amount of silicone sealant during disassembly; the logic board contains numerous applications.
Conversely, proceed with the same steps in reverse order.
Additional integrated circuits are required.
Only a small number of integrated circuits are still present.
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